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Nallathambi, A.
- Design of Micro Sensor with Cantilever Beam for Temperature Measurement
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Authors
Affiliations
1 Department of Electronics Engineering, Pondicherry University, IN
1 Department of Electronics Engineering, Pondicherry University, IN
Source
ICTACT Journal on Microelectronics, Vol 2, No 3 (2016), Pagination: 269-272Abstract
MEMS are systems of tiny devices, easy weight, enhanced performance and dependability detecting wider applications field of industrial, automotive and environment area, particularly in expressions of weather monitoring and estimate. In this work, design and simulation of MEMS sensor for temperature applications was proposed. An inherent platinum material for use temperature sensor can absolutely detect the sensor's working for temperature. The MEMS sensor is a single of the bimorph cantilever which deflections are felt by application of temperature. Basically, the cantilevers are thermally annealed to relax the thin film stresses. By changing the materials of bimorph, overall sensitivity can be changed. We use both platinum and titanium as the sensing material of temperature sensor to design process to integrate mechanical sensors into for example temperature for micro weather station. Finally, the proposed design can be used as a temperature sensor from 10°C to 60°C and also we obtained platinum as a good sensing material for detecting the temperature.Keywords
MEMS Sensor, Temperature, Cantilever, Displacement, Sensitivity.
- Design and Analysis of Perforated Si-Diaphragm Based MEMS Pressure Sensor for Environmental Applications
Abstract Views :179 |
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Authors
Affiliations
1 Department of Electronics Engineering, Pondicherry University, IN
1 Department of Electronics Engineering, Pondicherry University, IN
Source
ICTACT Journal on Microelectronics, Vol 2, No 1 (2016), Pagination: 209-215Abstract
The design is advanced which is an intelligent of calculating the output responses of perforated Si-diaphragm pressure sensor as a behavior of pressure and which compare them to piezoresistive Si-diaphragm. The systematic models based on small and large deflection theories have been applied to conclude the sensitivity and linearity of pressure sensors. The main aim of this paper was to design, simulate and analyze the sensitivity of both perforated and non-perforated Si-diaphragm based MEMS sensor to measure the linearity pressure values. The outer-micro machined diaphragms with square shapes are designed and tested to verify the simulation tool. The Intellisuite MEMS design tool has been used to produce and analyze the pressure sensors with perforated and Piezoresistive Si-Diaphragms. Here the study of sensor incorporating square diaphragm with piezoresistive and perforated Si-diaphragm were achieved and compared to realize the pressure sensitive components. In this perforated Si-diaphragm based pressure sensor has been illustrated to measure pressure range of 0.1MPa to 1Mpa. These simulation results have been formalized by comparing the deflection response estimated with piezoresistive Si-diaphragm model that is originated in this work by suitably modifying the bending of piezoresistive Si-diaphragms taking the perforation into account. Therefore a perforated Si-diaphragm based pressure sensor produced better displacement, sensitivity and stress output responses compared with the other type.Keywords
MEMS, Perforated Diaphragm, Displacement, Mises Stress and Sensitivity.- A Novel Efficient Security Veerification Technique Based on Service Package Identifier in Wireless Mobile Ad-Hoc Networks
Abstract Views :124 |
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Authors
Affiliations
1 Department of Artificial Intelligence and Machine Learning, Vemana Institute of Technology, IN
2 Department of Computer Science, Acharya Bangalore B School, IN
3 Department of Computer Science and Engineering, Adhiyamaan College of Engineering, IN
4 Department of Electronics and Communication Engineering, Roever Engineering College, IN
1 Department of Artificial Intelligence and Machine Learning, Vemana Institute of Technology, IN
2 Department of Computer Science, Acharya Bangalore B School, IN
3 Department of Computer Science and Engineering, Adhiyamaan College of Engineering, IN
4 Department of Electronics and Communication Engineering, Roever Engineering College, IN
Source
ICTACT Journal on Communication Technology, Vol 14, No 2 (2023), Pagination: 2907-2912Abstract
This paper presents a novel and efficient security verification technique for Wireless Mobile Ad-Hoc Networks (MANETs) using The Service Package Identifier (SPI). The dynamic and self-organizing nature of MANETs makes them susceptible to a variety of security threats. Using the SPI, the proposed technique authenticates and verifies the integrity of service bundles exchanged between network nodes. By employing the SPI as a unique identifier for each service packet, the technique protects against unauthorized access and data tampering and ensures secure communication. The experimental results demonstrate the efficacy and efficiency of the proposed technique, which offers improved MANET security and resiliency.Keywords
Security Verification, Service Package Identifier, Authentication, Integrity, Secure Communication, Unauthorized Access, Data Tampering, Resilience.References
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